The high-precision intelligent gripper relies on multi-modal sensor fusion technology to achieve a technological breakthrough in the field of precision assembly. Its adaptive grasping algorithm achieves a dynamic positioning accuracy of ±0.02mm.
It is deeply used in the motherboard micron-level assembly system in 📱3C smart manufacturing, the wafer box nano-level positioning device in 💎semiconductor clean engineering, and the power battery pole multi-modal grasping platform in 🔋new energy smart manufacturing, realizing cross-industry technology ecosystem integration in the field of high-end manufacturing.
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